India First Semiconductor Chip – In a significant step toward India’s goal of semiconductor self-reliance, Electronics & IT Minister Ashwini Vaishnaw launched the nation’s first pilot OSAT (Outsourced Semiconductor Assembly and Test) facility, named the G1 unit, in Sanand, Gujarat, on August 28, 2025
Semiconductor Chip
During the inauguration, Minister Vaishnaw highlighted that the G1 facility is equipped to produce up to 500,000 chips daily. He announced that the first chip from this facility will be dedicated to the nation by Prime Minister Narendra Modi in the near future. Supporting this, Minister of State for Electronics & IT, Jitin Prasada, confirmed that India’s first packaged semiconductor chip is on track for release by December 2025.
The establishment of the OSAT G1 facility marks a pivotal moment in India’s journey toward building a robust domestic semiconductor ecosystem. Sheila. By enabling onshore chip assembly and testing, the facility reduces reliance on imports, fosters high-skill job creation, and positions India as an emerging hub for global semiconductor investment.
This development aligns with Prime Minister Modi’s vision of introducing “Made-in-India” chips to the market by the end of 2025, strengthening the Electronics System Design and Manufacturing (ESDM) sector and driving technological and economic growth.
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