India is taking a monumental leap toward technological self-reliance with the approval of four new semiconductor manufacturing projects under the India Semiconductor Mission. Announced by the Union Cabinet, chaired by Prime Minister Shri Narendra Modi, these initiatives in Odisha, Punjab, and Andhra Pradesh involve a ₹4,600 crore investment, reinforcing India’s ambition to become a global leader in the semiconductor industry.
A Strategic Boost for India’s Semiconductor Ecosystem
The India Semiconductor Mission continues to gain momentum, with these new projects bringing the total number of approved initiatives to 10, spanning six states and attracting investments of approximately ₹1.60 lakh crore. Led by SiCSem Private Limited, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package Technologies, these facilities will create over 2,000 high-skill jobs and drive thousands of indirect employment opportunities, fueling economic growth and innovation.
Key Projects Driving India’s Semiconductor Revolution
- SiCSem’s Groundbreaking Silicon Carbide Facility in Odisha
In Bhubaneswar’s Info Valley, SiCSem, in partnership with a UK-based technology firm, will establish India’s first commercial Silicon Carbide (SiC) semiconductor fab. With an annual capacity of 60,000 wafers and 96 million packaged units, this facility will produce components for electric vehicles, defense systems, railways, solar inverters, and data centers, positioning India as a hub for advanced compound semiconductors. - 3D Glass Solutions’ Advanced Packaging Unit in Odisha
Also located in Bhubaneswar, 3D Glass Solutions will introduce a cutting-edge advanced packaging facility focused on glass-based substrates. With a capacity of 69,600 glass panels and 50 million assembled units annually, this plant will support applications in artificial intelligence, defense, automotive, and high-performance computing, bringing next-generation packaging technology to India. - ASIP Technologies’ Manufacturing Hub in Andhra Pradesh
Partnering with a South Korean firm, ASIP Technologies will set up a semiconductor unit in Andhra Pradesh, producing 96 million units annually. The facility will cater to the growing demand for components in smartphones, automotive systems, and consumer electronics, strengthening India’s electronics manufacturing ecosystem. - CDIL’s Expansion in Punjab
In Mohali, Punjab, CDIL will expand its discrete semiconductor facility to produce high-power devices like MOSFETs and transistors in Silicon and SiC. With an annual capacity of over 158 million units, this project will support electric vehicle infrastructure, renewable energy systems, and telecommunications, enhancing India’s leadership in discrete semiconductors
India Semiconductor Mission (Photo Credit – Canva AI)
Why This Matters for India
These projects mark a pivotal moment in India’s journey toward Atmanirbhar Bharat (self-reliant India). By establishing the nation’s first commercial compound semiconductor fab and an advanced glass-based packaging unit, India is diversifying its capabilities in a critical global industry. The facilities will address the rising demand for semiconductors in sectors like telecom, automotive, and consumer electronics, driven by trends in AI, 5G, and electric mobility.
Economic and Social Impact
- Job Creation: The projects will generate 2,034 direct jobs for skilled professionals and thousands of indirect opportunities in supply chains and services.
- Regional Growth: Odisha, Punjab, and Andhra Pradesh will emerge as key hubs for electronics manufacturing, spurring local economies.
- Skill Development: The India Semiconductor Mission has already trained over 60,000 students through talent development programs, supported by 278 academic institutions and 72 startups, building a robust talent pipeline.
India’s Global Semiconductor Ambitions
With the global semiconductor market expected to grow significantly, India is positioning itself as a key player. The India Semiconductor Mission is fostering innovation in chip design, manufacturing, and packaging, reducing reliance on imports and enhancing supply chain resilience. These projects complement India’s growing chip design ecosystem, supported by government-backed infrastructure and incentives.
Source : Ministry of Electronics & IT
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